SAN JOSE, Calif.--(BUSINESS WIRE)--Oct. 28, 2015--
Inc. (NYSE:INVN), the leading provider of MEMS sensor platforms,
today announced it has released for OEM review UltraPrint™,
its ultrasonic fingerprint imaging solution, manufactured on the
proprietary InvenSense CMOS-MEMS Platform (ICMP), offering ramp to
production in calendar year 2017. As the world’s largest fabless MEMS
SOC innovator and source for the eutectically bonded ICMP, InvenSense
ships, on average, over twelve million motion or audio sensor SOCs each
week to leading global mobile and IoT OEMs.
By adding aluminum nitride-based piezoelectric capacity to its platform,
InvenSense is enabling, for the first time, mass manufacture of unique
piezoelectric Micromachined Ultrasonic Transducers (pMUT) and transducer
arrays, with each transducer element individually controllable through
direct wafer-level interconnect to the CMOS ASIC.
This dramatic advancement in acoustic imaging technology will allow
manufacturers to seamlessly integrate, on a platform proven capable of
accommodating exceptionally high volumes, detailed fingerprint images
from the epidermal to dermal layers, and to do so directly through glass
or metal, even in the presence of oil, lotions, perspiration or other
moisture, and other common contaminants that can easily undermine legacy
capacitive solutions. These critical factors enhance live finger
authentication and guard against spoofing, thereby increasing security.
Fari Assaderaghi, InvenSense’s Vice President Advanced Technology,
commented: “Our proprietary UltraPrint technology is expected to enable,
for the first time, deployment of ultrasonic fingerprint solutions under
glass, as well as a myriad of other surfaces. This flexibility in sensor
placement without cutting a hole in display glass, aluminum, steel or
plastic case material is highly valued by mobile and other OEMs. Our
innovative team is excited to work with equally motivated partners to
quickly bring this new technology to market.”
Mo Maghsoudnia, InvenSense’s Vice President Worldwide Manufacturing,
added: “As a leading innovator in MEMS and sensor technology globally,
and the world’s only fabless MEMS SOC vendor selling hundreds of
millions of motion and audio sensors each year, we have a proven track
record of rapidly ramping up innovative new MEMS solutions into mass
production. We’re excited to extend the InvenSense CMOS-MEMS Platform to
pMUT devices and enable a breakthrough authentication solution for
leading mobile and IoT products.”
For additional information about UltraPrint™ ultrasonic fingerprint
imaging solution, please contact InvenSense Marketing at email@example.com.
This press release contains forward-looking statements within the
meaning of Section 27A of the Securities Act of 1933 and Section 21E of
the Securities Exchange Act of 1934, including statements regarding the
features and benefits of InvenSense’s products and the anticipated
impact of its new products to advance acoustic imaging technology and
deployment of ultrasonic fingerprint solutions on a global scale. Actual
results may vary materially due to a number of factors including, but
not limited to, the risk that InvenSense’s products do not operate as
intended or do not receive market acceptance, the loss of a key
customer, claims of technology infringement, general economic conditions
and other risks detailed from time to time in InvenSense’s Quarterly
Report on Form 10-Q for the quarter ended June 28, 2015 and other SEC
reports, which can be found at www.sec.gov.
Readers are cautioned not to place undue reliance on these
forward-looking statements, which speak only as of the date hereof.
InvenSense undertakes no obligation to publicly release or otherwise
disclose the result of any revision to these forward-looking statements
that may be made as a result of events or circumstances after the date
hereof or to reflect the occurrence of unanticipated events.
InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of MEMS
sensor platforms. The company’s patented InvenSense
Fabrication Platform and MotionFusion® technology address
the emerging needs of many mass-market consumer applications via
improved performance, accuracy, and intuitive motion-, gesture- and
sound-based interfaces. InvenSense technology can be found in Mobile,
Wearables, Smart Home, Industrial, and Automotive products. InvenSense
is headquartered in San Jose, California and has offices in Boston,
China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More
information can be found at www.invensense.com
or follow us on Twitter at @InvenSense.
©2015 InvenSense, Inc. All rights reserved. InvenSense, Sensing
Everything, UltraPrint, FireFly, MotionTracking, MotionProcessing,
MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and
the InvenSense logo are trademarks of InvenSense, Inc. Other company and
product names may be trademarks of the respective companies with which
they are associated.
View source version on businesswire.com: http://www.businesswire.com/news/home/20151028005518/en/
Source: InvenSense, Inc.
David Almoslino, 408-501-2278